Conference Publication Details
Mandatory Fields
Kehoe, L,Kelly, PV,OConnor, GM,OReilly, M,Crean, GM
A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A
1995
December
Published
1
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Optional Fields
thermal diffusivity photothermal radiometry multichip module ceramic materials laser flash diffusivity PULSED PHOTOTHERMAL RADIOMETRY SPECTRA
773
780
Alumina derivative ceramics and low temperature co-fired ceramic (LTCC) electronic multichip module (MCM) packaging substrates have been characterized using single- and double-sided inspection laser flash thermal diffusivity measurement techniques. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary single-sided measurement methodology is proposed.
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